Fully Automatic Wire Bonders

Fully automated Wedge-Wedge Bonders, ultrasonic Flip-Chip Bonders as well as special bonding tools for Electronic vehicle battery bonding applications.

Current Series Machines:

• • Fine Wire Bonders (12.5µm – 75µm)
    Bondjet BJ653 (Bonder for manual or automatic bonding (Wedge-Wedge and Ball-Wedge)
    Bondjet BJ855 (High Speed Fully Automatic Fine Wire Bonder(Wedge-Wedge and Ball-Wedge)
  • Heavy Wire Bonders (50µm – 600µm)
    Bondjet BJ931 (Fully Automatic Dual-Head Leadframe Wedge-Wedge Bonder for heavy wire, fine wire and ribbon (Al, AlCu, Cu)
    Bondjet BJ955/BJ959(Fully Automatic Heavy Wire Wedge-Wedge Bonder for heavy wire and ribbon (Al, AlCu, Cu)
    Bondjet BJ985(Fully Automatic Heavy Wire Wedge Bonder with a large working area)
    Bondjet BJ980(Fully Automatic Heavy Wire Wedge-Wedge Bonder especially for large-sized substrates like solar and battery applications)
  • Bondjet BJ653(wedge-wedge as well as ball-wedge bonder and can handle fine wire, heavy wire and ribbon)

For more details, please contact MCube Technologies