XYZTEC is the market and technology leader in bond testing and are 100% focused on bond testing and have established their name as technology leader in bond testing worldwide.

XYZTEC is a high technology based company, applying mechatronics and electronics, advanced precision mechanics and dedicated software to design innovative equipment that is used to control the quality of bonds of industrial products.

Their equipment is used worldwide in the semiconductor, automotive and raw material industry.

For more details, please contact MCube Technologies or visit website www.xyztec.com

Manufacturer of wire bonders (manual, semiautomatic & automatic machines), wedge bond, ball bond.

For more details, please contact MCube Technologies or visit website www.tpt.de

SVCS Process Innovation designs and manufactures batch horizontal and vertical diffusion, PECVD and LPCVD furnaces for the semiconductor and photovoltaic industries, or related R&D institutes.

For more details, please contact MCube Technologies or visit website www.svcs.com

Finetech is the leading equipment manufacturer for sub-micron die bonding & advanced SMD rework. They provide solutions for each stage of your journey – from R&D to industrial automated production.

For more details, please contact MCube Technologies or visit website www.finetech.de

Diamond WireTec GmbH & Co.KG develops, produces and sells diamond wire saws as well as diamond wires and accessories worldwide.

Their diamond wire saws are primarily used in industrial laboratories and engineering offices as well as in institutes and universities. The applications are mostly in research, development and quality assurance with the analysis of materials and components.

The cutting process with diamond wire saws offers several advantages over conventional cutting processes.

For more details, please contact MCube Technologies or visit website www.diamondwiretec.com