Plasma Etcher PE2000

Product Overview

The PE 2000 RF Plasma Etcher is specifically designed for reactive gas plasma etching and surface treatments. The unit is capable of 150 watts RF forward power at 13.56 MHz and up to four gas processing. The system is ideal for R&D applications where single sample processing is needed and total control of each process parameter is necessary.

Full Description

Processes such as photoresist strip, BPSG removal, oxide and nitride layer etch, surface treatment of plastics and plasma cleaning are typical applications. Samples up to 6" diameter as well as irregular shaped substrates can be accommodated in the 200mm diameter vacuum chamber. A fully manual control system coupled with digital readouts and integral matching network with switching type power generator offer a wide range of experimental etch parameters.

Features

High etch rates at moderate power levels of 100 watts forward power -200 Å/minute for oxide and 500Å/minute for nitride -Stainless steel delivery lines and chamber for corrosive applications -Fomblin charged corrosive series mechanical pump standard -Safety interlocks prevent mis-operation -Manual controls enable wide range of parameter selectivity -Up to four mass flow channels can be adapted to allow 5 different gas species.

Specifications

Vacuum Pump: 43 l/min two stage corrosive series pump Base pressure: 20 mtorr Vacuum Readout: Capacitance manometer Vacuum Chamber: Quartz, 8" OD x 4" high RF Power: User variable 0-150 watt; 13.56 MHz Process Timer: Auto-termination of etch up to 99:99:59 Input Power: 115/230 VA, 50/60 Hz, 10/5 amps Dimensions: 20.25" W x 16" D x 15" H System Vent: Independent interlocked for N2 Gas Delivery: Two channels, solenoid valve interlocked Gas Control: Dual independent needle valves Sample Table: 6" diameter stainless steel System Weight: 60 pounds (without rotary pump)

Accessories Available

PE2000-001
The quartz chamber is used for most standard plasma etching proessing stages. The chamber is 8" OD x 5" high and allows a wide range of samples sizes to be processed.

PE2000-002
The RF shield is required when the PE2000-001 is used. The shield prevents any stray RF fields from entering the lab area.

PE2000-003
The stainless steel chamber is a sturdy chamber which allows the user to mount accessories onto the chamber, such as vacuum gauges and optical emission spectrometers for process monitoring.

PE2000-004
The diaphragm pump can be used in place of the rotary pump for backing of the turbo pump if a dry, oil free system is desired.

PE2000-005
The addition of a mass flow controller (MFC) can be helpful to ensure a constant, uniform delivery of reaction gas to the process chamber.

PE2000-006
The addition of a mass flow controller (MFC) can be helpful to ensure a constant, uniform delivery of reaction gas to the process chamber.

PE2000-007
The addition of a mass flow controller (MFC) can be helpful to ensure a constant, uniform delivery of reaction gas to the process chamber.